Cooling Analysis is used to analyze the change of the blank parameters such as temperature, stress and strain during the cooling process after blank thermal forming. Since the setup of cooling analysis is similar to the one of thermal forming, the user can refer to thermal forming for the related setup information. The cooling analysis is usually the subsequent process of thermal forming, so the user may add cooling analysis step after completing the setup of thermal forming, as is illustrated in Figure 8.3.109.

Figure 8.3.109  Create cooling step